MEMS| CITIZEN FINEDEVICE CO.,LTD.

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What is MEMS?

MEMS (Micro Electro Mechanical Systems) is a component, which is formed by integrating mechanical parts, sensors, actuators and electronic circuits on a silicon substrate, a glass substrate, an organic material or other materials, using the microfabrication technique.
Due to process limitations or different materials, the mechanical structure and the electronic circuit may use different chips. Such hybrid system is also called MEMS.

How does CITIZEN FINEDEVICE Co.,LTD. think about MEMS?

Since the MEMS processing technology was created, we have had more than 20 years experience and developed sensor MEMS, actuator MEMS and package MEMS.
Along with the above technology development, we have specialized in the micro-machining technology for substrate materials other than Si (ceramics, glass and crystal) continuously, established relevant systems, utilized crystal oscillator manufacturing technology and established wafer manufacturing process. And we provide services from cutting to packaging.
At present, the company is involved in the fields of electronic parts for people’s life, clock parts and medical industry. It realizes the achievement in mass production of medical detection boards, the realization of which is attributed to our proprietary substrate processing technology, and also reflects the advantages of film forming technology.
In addition to our products, we also have the ability to use MEMS technology and micro machining technology to manufacture precision molds.
In terms of trial production and development in the process, we combine the proprietary technologies to provide the best scheme, and as a wafer foundry, we can achieve one-stop production from wafer processing to packaging to meet the requirements of customers.

The history of MEMS

MEMS began with micro machining in the 1960s.
Strain gauges with the piezoresistive effect of monocrystalline silicon applied were developed around 1970 and used as strain sensors.
After that, isotropic and anisotropic silicon wet etching was developed, and it became possible to form physical structures in addition to piezoresistive elements. It has been used as a pressure sensor for automobiles since the latter half of the 1970s. At present, MEMS components are evolving into components with more complex mechanisms, such as acceleration sensors for automobile airbags, inkjet print heads, digital mirror devices and so on.
(Reference: Trends of MEMS Components and the Role of Vacuum Technology /Yasushi Goto, Akira Koide)

Product group with MEMS applied

MEMS was developed in the middle of the 20th century. It has been used for built-in acceleration sensors or gyroscopes in smart phones and other devices since 2000.
Its range of use has been expanded. As a movable semiconductor, MEMS technology is used in a wide range of fields such as vehicles / automatic driving, big data, AI, robotics, health care, environment and energy, and the latest relevant technologies emerge in endlessly.
CITIZEN FINEDEVICE is realizing a wide range of application-aware product development, such as smart phones upgrades, IoT (Internet of things), automatic driving, VR (virtual reality), AR (augmented reality), 5G communications.

MEMS market

MEMS market includes areas in sensors (inertia, pressure, microphone, environment, optics, etc.), actuators (ink-jet print heads, microfluidic and RF, etc.), automobiles, household appliances, defense, health care, communication, aerospace and others.
The products, the final use of which are oriented to customers, account for 60%. According to the statistics of Yole Développement, a semiconductor market trend research company in France, its market scale was estimated to be US $7.13 billion in 2020.
It is forecast that the market will continue to expand at an average annual rate of 8% in the future, reaching US $11.27 billion in 2026.
The vehicle market ranks second, with the market scale reaching US $2.03 billion in 2020. It is expected to continue to expand at an average annual rate of about 6% in the future, reaching US $2.86 billion in 2026.
The communication infrastructure market, which is expected to grow rapidly in the future, is estimated to grow from US $60 million in 2020 to US $140 million in 2026, with an average annual expansion of about 17%.

Equipment list

Technology		Devices	Machining dimension	Content for processing
Film forming	Deposition	Deposition devices	～6 inches	Metal, alloy, oxide film, nitride film, AuSn, special materials, etc
	Sputtering	Sputtering devices	～6 inches	Metal, alloy, oxide film, nitride film, special materials, etc
	SiO2 film forming	Thermal oxidation furnaces	～6 inches	SiO2 film formation (~5μm)
	SiO2 film forming	TEOS-CVD devices	～8 inches	SiO2 film formation
	Galvanoformung, electroless galvanoformun	Galvanoformung and electroless galvanoformun devices	～4 inches	Ni、Cu、Au、SnAg
	Printing	Screen printing devices	～8 inches	Electrode film, water-repellent film, oil-repellent film
Photolithography	Photoresist coating	Spin Coaters	～6 inches	Photoresist and polyimide coating
		Coating machines	～8 inches	photoresist coating
		Laminators	～6 inches	Dry film lamination
	Baking	Baking ovens	～6 inches	Photoresist hardening
		Hot plates	～6 inches	Photoresist hardening
		Curing ovens	～6 inches	Polyimide hardening
	Exposure	Contact aligners	～6 inches	Pattern formation (processing capacity : larger than 3 μm)
	Exposure	Steppers	～4 inches	Pattern formation (processing capacity : larger than 1 μm)
	Developing	Puddle developing devices	～6 inches	Photoresist, polyimide development
		Conveyors	～6 inches	Dry film development
		Dip developing baths	～6 inches	Photoresist, polyimide, dry film development
	Lift off	Lift-off devices	～4 inches	Removing photoresist through swelling, shaking and ultrasonic (processing capacity : larger than 5 μm)
Etching	Dry etching	ICP-RIE devices	～6 inches	Si etching
	Dry etching	RIE devices	～6 inches	Si and SiO2 etching
	Blasting	Blasting devices	～8 inches	Si, glass and ceramic etching
	Ion milling	Ion milling devices	～4 inches	Metal, SiO2 and Si etching
	Laser machining	Laser-beam perforation machines	～6 inches	Si and ceramic perforation processing
	Wet etching	Wet etching baths	～6 inches	Si, SiO2 and crystal etching
Substrate cutting	Cutting	Blade cutting devices	～6 inches	Substrate cutting
Substrate grinding	Lapping	Lapping devices	～6 inches	Substrate grinding
Substrate grinding	Polishing	Polishing devices	～6 inches	Substrate grinding

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